5G구현기술비교 MWP TriPleX Beamforning Comparison
라이오닉스글로벌의 특허 원천기술 TriPleX™의 놀라운 기술력으로 구현할 5G는 월등한 성능으로 다른 기술을 현저히 앞서고 있습니다. MWP TriPleX와 기존의 다른 PCB, RF CMOS, RF MEMS, Digital, RF MMIC 기술들의 비교를 통하여 라이오닉스글로벌가 열어갈 5G시대의 획기적인 기술력을 확인할 수 있습니다.
Microwave photonics is an emerging field in which radio frequency (RF) signals are generated, distributed, processed and analyzed using the strength of photonic techniques. It is a technology that enables various functionalities which are not feasible to achieve only in the microwave domain. A particular aspect that recently gains significant interests is the use of photonic integrated circuit (PIC) technology in the MWP field for enhanced functionalities and robustness as well as the reduction of size, weight, cost and power consumption
Digital beam forming is based on the conversion of the RF signal at each antenna elements into streams of binary baseband signals.
Complementary metal–oxide–semiconductor is a technology for constructing integrated circuits. CMOS technology is used in microprocessors, microcontrollers, static RAM, and other digital logic circuits. CMOS technology is also widely used for RF circuits all the way to microwave frequencies, in mixed-signal (analog+digital) applications.
The radio frequency microelectromechanical system refers to electronic components of which moving sub-millimeter-sized parts provide RF functionality.